LED chip



FIG. 1 is a 3D view of a LED chip according to a first embodiment of thepresent disclosure, in which the light emitting layer is provided withmultiple holes penetrating through the light emitting layer and exposingthe substrate;

FIG. 2 is another 3D view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 3 is a top view of the LED chip according to the first embodimentof the present disclosure;

FIG. 4 is a left-side view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 5 is a right-side view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 6 is a front-side view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 7 is a rear-side view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 8 is a bottom view of the LED chip according to the firstembodiment of the present disclosure;

FIG. 9 is a 3D view of a LED chip according to a second embodiment ofthe present disclosure;

FIG. 10 is a another 3D view of the LED chip according to a secondembodiment of the present disclosure;

FIG. 11 is a top view of the LED chip according to a second embodimentof the present disclosure;

FIG. 12 is a cross-sectional view of the LED chip along line 12-12 inFIG. 11;

FIG. 13 is a left-side view of the LED chip according to a secondembodiment of the present disclosure;

FIG. 14 is a right-side view of the LED chip according to a secondembodiment of the present disclosure;

FIG. 15 is a front-side view of the LED chip according to a secondembodiment of the present disclosure;

FIG. 16 is a rear-side view of the LED chip according to a secondembodiment of the present disclosure; and,

FIG. 17 is a bottom view of the LED chip according to a secondembodiment of the present disclosure.

CLAIM The ornamental design for an LED chip, as shown and described.